Creating low-impedance tetrodes by electroplating with additives.

نویسندگان

  • John E Ferguson
  • Chris Boldt
  • A David Redish
چکیده

A tetrode is a bundle of four microwires that can record from multiple neurons simultaneously in the brain of a freely moving animal. Tetrodes are usually electroplated to reduce impedances from 2-3 MΩ to 200-500 kΩ (measured at 1 kHz), which increases the signal-to-noise ratio and allows for the recording of small amplitude signals. Tetrodes with even lower impedances could improve neural recordings but cannot be made using standard electroplating methods without shorting. We were able to electroplate tetrodes to 30-70 kΩ by adding polyethylene glycol (PEG) or multi-walled carbon nanotube (MWCNT) solutions to a commercial gold-plating solution. The MWCNTs and PEG acted as inhibitors in the electroplating process and created large-surface-area, low-impedance coatings on the tetrode tips.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Improving Impedance of Implantable Microwire Multi-Electrode Arrays by Ultrasonic Electroplating of Durable Platinum Black

Implantable microelectrode arrays (MEAs) have been a boon for neural stimulation and recording experiments. Commercially available MEAs have high impedances, due to their low surface area and small tip diameters, which are suitable for recording single unit activity. Lowering the electrode impedance, but preserving the small diameter, would provide a number of advantages, including reduced stim...

متن کامل

Seed - layer deposition Patterning Insulator deposition and patterning Seed - layer deposition Seed layer Substrate

Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievabl...

متن کامل

Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films

To understand a void formation mechanism in electroplated Cu interconnects used for Si-ULSI (ultra-large scale integrated) devices, microstructures of Cu films which were prepared by the electroplating technique using plating baths with or without organic additives were investigated by transmission electron microscopy (TEM). In the as-deposited samples, a high density of micro-voids were observ...

متن کامل

Surface Modification of Glassy Carbon Electrode by Ni-Cu Nanoparticles as a Competitive Electrode for Ethanol Electro-Oxidation

In the present study, Nickel-Copper nanoparticles were electrodeposited on glassy carbon electrode (GCE) by using electroplating deposition method. The prepared electrode was characterized by scanning electron microscopy (SEM) and elemental mapping analysis. Results showed that Ni-Cu nanoparticles with a high density are distributed at the surface of the glassy carbon electrode. Subsequentl...

متن کامل

Toxicity effects of nickel electroplating effluents treated by photoelectrooxidation in the industries of the Sinos River Basin.

The Sinos river Basin is an industrial region with many tanneries and electroplating plants in southern Brazil. The wastewater generated by electroplating contains high loads of salts and metals that have to be treated before discharge. After conventional treatment, this study applied an advanced oxidative process to degrade organic additives in the electroplating bright nickel baths effluent. ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Sensors and actuators. A, Physical

دوره 156 2  شماره 

صفحات  -

تاریخ انتشار 2009